DLW · Machine & Process

10× VISIONONE 2D HOLDERSHUTTER CLOSED

Optical cutawayLabelsEnclosure

100 mmPhysical scale · no motion amplification

NANO XYSIMULATED

X 0.00 µmY 0.00 µm

±100 µm per axis · 200 µm total travel

EXPLORE THE ASSEMBLY

One physical scale, from the coarse stage to the optics.

Drag to orbit · Scroll to zoom · Click a component

Metalens wafer

4″ / 101.6 mm

Load, register, level and write. Machine calibrations are reused for every wafer.

Ø150 µm metalens600 nm pitch · r 150–200 nmPoint exposures · illustrative radius map and 200 µm metalens spacing.

Taught lens position Target gap

µm

Metalenses in demo Registration

Positions 1–4 refer to one holder. Their coordinate map is unspecified; demo positions share one datum.

Find waferFind 2D lens

01 Load02 Register03 Level04 Gap05 Pillars06 Unload

POINT EXPOSURES0 / —

READYFirst 12 point cycles shown slowly

Actual gap79.48 µm

Recipe target20.0 µm

Measured tilt—

Measured tip—

Lens focus z1—

Wafer focus z2—

Machine calibration

Persistent

Startup, mechanical verification, six camera transforms, planes, gap compensation and UV alignment. Results are synthetic training data.

Inspect the machine

True units

Turret station

Explore a component

Click the model to see its function and reference. Optical cutaway reveals glass inside the objective barrels.

Dimensions & reference basis

Overall envelope: 1800 × 900 × 1855 mm, R4 p.7. Wafer: 101.6 mm, user estimate. Fine XY: 200 µm total, user estimate.

Holder: 42 mm; turret inclination: 15°; wafer thickness: 0.525 mm. These and other internal dimensions are visual estimates, not measured CAD.

Geometry: R4 pp.10–15,18,43. Operations: R009 pp.32–43,56. Vision: R002 pp.17–22,24–33. SPC datasheet describes general capabilities; it does not specify this machine’s exact path.

Parts visibility

Show or hide entire assemblies or individual parts. Hidden parts continue moving with the simulation.

Support pillars and metalens nanopillars have separate controls. Solo isolates a part or assembly. Enclosure is hidden by default.

Ready to explore0:00

Speed

Vision monitor

Synthetic

Feature score—Sharpness—Offset XY0.0, 0.0 µm

Process log 0 events

REFERENCE-BASED SIMULATION
Internal dimensions and optical prescriptions are estimated. Beam width is a visibility aid; exact ray optics and hardware timing are not simulated.