DLW · Machine & Process

10× VISIONONE 2D HOLDERLASER / OFF

Optical cutawayLabelsEnclosure

100 mmPhysical scale · no motion amplification

NANO XYSIMULATED

X 0.00 µmY 0.00 µm

±100 µm per axis · 200 µm total travel

EXPLORE THE ASSEMBLY

One physical scale, from the coarse stage to the optics.

Drag to orbit · Right-drag to pan · Scroll to zoom · Double-click wafer to inspect

Metalens wafer

4″ / 101.6 mm

Load, register, level and write. Machine calibrations are reused for every wafer.

Ø150 µm metalens600 nm pitch · r 150–200 nmLeft-to-right rows, top-to-bottom · 200 µm metalens spacing.

Recipe · 2D lens Target gap

µm

Point period (ms) Metalenses in demo Registration

Select one of four interchangeable lenses. The operator fits only that lens into the small holder aperture; the other lenses stay outside the machine.

Find waferFind 2D lens

01 Load02 Register03 Level04 Gap05 Dents06 Unload

POINT EXPOSURES0 / —

READYUniform point timing · 1× playback

650 ms per dent is an editable demo timing, not measured machine throughput.

Actual gap79.48 µm

Recipe target20.0 µm

Measured tilt—

Measured tip—

Lens focus z1—

Wafer focus z2 · corrected mean—

Four wafer focus points determine the plane and gap.

Machine calibration

Persistent

Startup, mechanical verification, six camera transforms, nano-stage fiducial verification, four interchangeable lens profiles, planes, gap compensation and UV alignment. Results are synthetic training data.

Inspect the machine

True units

Turret station Camera conversion

Manual lens exchange

Holder closed · Lens 1 fitted

Available lens

One optic at a time. Open the clamp to exchange lenses from outside.

Explore a component

Click the model to see its function and reference. Optical cutaway reveals glass inside the objective barrels.

Dimensions & reference basis

Overall envelope: 1800 × 900 × 1855 mm, R4 p.7. Wafer: 101.6 mm, user estimate. Fine XY: 200 µm total, user estimate.

Holder: 42 mm; turret inclination: 15°; wafer thickness: 0.525 mm. These and other internal dimensions are visual estimates, not measured CAD.

Geometry: R4 pp.10–15,18,43. Operations: R009 pp.32–43,56. Vision: R002 pp.17–22,24–33. SPC datasheet describes general capabilities; it does not specify this machine’s exact path.

Parts visibility

Show or hide entire assemblies or individual parts. Hidden parts continue moving with the simulation.

Support pillars and metalens dents have separate controls. Solo isolates a part or assembly. Enclosure is hidden by default.

Manual beam preview while idle. Production controls each exposure automatically.

Vision monitor

Synthetic

Feature score—Sharpness—Offset XY0.0, 0.0 µm

Process log 0 events

REFERENCE-BASED SIMULATION
Internal dimensions and optical prescriptions are estimated. Beam width is a visibility aid; exact ray optics and hardware timing are not simulated.